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pc3h41xnip0f series ? 4-channel package type is also available. (model no. ) 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc3h41) 2. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. programmable controllers 2. facsimiles 3. telephones applications mini-flat half pitch package, high cmr, ac input, low input current photocoupler 1. 4-pin mini-flat half pitch package (lead pitch : 1.27mm) 2. double transfer mold package (ideal for flow soldering) 3. ac input type 4. low input current type (i f =0.5ma) 5. high collector-emitter voltage (v ceo : 80v) 6. high noise immunity due to high common mode rejection voltage (cmr : min. 10kv/ s) 7. isolation voltage between input and output (v iso(rms) : 2.5kv) 8. rohs directive compliant description pc3h41xnip0f series contains a ired optically coupled to a phototransistor. it is packaged in a 4-pin mini-flat, half pitch type. input-output isolation voltage(rms) is 2.5kv. collector-emitter voltage is 80v, ctr is 50% to 400% at input current of 0.5ma, and cmr is min. 10kv/s. 1 sheet no.: d2-a02102fen date jun. 30. 2005 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc3h41xnip0f series
internal connection diagram anode /cathode cathode / anode emitter collector 1 1 2 3 4 2 4 3 2 sheet no.: d2-a02102fen outline dimensions (unit : mm) h 4 1 0.4 0.1 4.4 0.2 0.2 0.05 5.3 0.3 0.5 +0.4 ? 0.2 7.0 +0.2 ? 0.7 primary side mark sharp mark "s" rank mark 0.1 0.1 2.0 0.2 epoxy resin 1.27 0.25 2.6 0.3 1 4 3 2 date code (1.7) *( ) : reference dimensions product mass : approx. 0.05g plating material : sncu (cu : typ. 2%) pc3h41xnip0f series
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production 3 repeats in a 20 year cycle sheet no.: d2-a02102fen rank mark refer to the model line-up table country of origin japan pc3h41xnip0f series
sheet no.: d2-a02102fen electro-optical characteristics parameter conditions forward voltage terminal capacitance collector dark current transfer charac- teristics emitter-collector breakdown voltage collector current collector-emitter breakdown voltage collector-emitter saturation voltage isolation resistance min. ? ? ? 6 0.25 ? 510 10 ? ? typ. 1.2 30 ? ? ? ? ? 110 11 4 3 max. 1.4 250 100 ? ? 2.0 0.2 ? 18 18 unit v v pf na v ma v ? s s symbol v f c t i ceo bv ceo bv eco i c v ce (sat) t r t f r iso response time rise time fall time input output i f =10ma v=0, f=1khz v ce =50v, i f =0 i c =0.1ma, i f =0 i e =10a, i f =0 i f =0.5ma, v ce =5v dc500v, 40 to 60%rh v ce =2v, i c =2ma, r l =100? floating capacitance ? 0.6 1.0 pf c f v=0, f=1mhz i f =10ma, i c =1ma 80 (t a =25?c) 10 ?? kv/s cmr common mode rejection voltage t a =25?c, r l =470?, v cm =1.5kv(peak), i f =0, v cc =9v, v np =100mv absolute maximum ratings (t a =25?c) parameter symbol unit input forward current ma *1 peak forward current ma power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *2 isolation voltage operating temperature ?c storage temperature ?c *3 soldering temperature i f i fm p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 pulse width100s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1 minute, f=60hz *3 for 10s rating 10 200 15 80 6 50 150 170 ? 30 to +100 ? 40 to +125 260 2.5 kv 4 pc3h41xnip0f series
sheet no.: d2-a02102fen model line-up i c [ma] (i f =0.5ma, v ce =5v, t a =25?c) with or without a 0.25 to 2.0 0.5 to 1.5 package rank mark model no. pc3h410nip0f PC3H411NIP0F 3 000pcs/reel taping 5 please contact a local sharp sales representative to inquire about production status. pc3h41xnip0f series
sheet no.: d2-a02102fen total power dissipation p tot (mw) ambient temperature t a (?c) 0 200 150 170 100 50 ? 30 0 25 50 75 100 125 250 fig.5 total power dissipation vs. ambient temperature forward current i f (ma) ambient temperature t a (?c) 0 10 15 5 ? 30 0 25 50 75 100 125 fig.2 forward current vs. ambient temperature diode power dissipation p (mw) ambient temperature t a (?c) 0 15 10 5 ? 30 0 25 50 75 100 125 fig.3 diode power dissipation vs. ambient temperature collector power dissipation p c (mw) ambient temperature t a (?c) 0 200 250 150 100 50 ? 30 0 25 50 75 100 125 fig.4 collector power dissipation vs. ambient temperature 6 fig.1 test circuit for common mode rejection voltage v cm v cp v np v o (dv/d t ) 1) r l v np v cc v cm 1) v cp : voltage which is generated by displacement current in floating capacitance between primary and secondary side. (v cp nearly = dv/d t c f r l ) v cm : high wave pulse r l =470? v cc =9v ? ? ? ? ? pc3h41xnip0f series
sheet no.: d2-a02102fen relative current transfer ratio (%) ambient temperature t a (?c) ? 30 100908070605040302010 0 ? 10 ? 20 v ce =5v i f =0.5ma 0 150 100 50 fig.10 relative current transfer ratio vs. ambient temperature collector-emitter saturation voltage v ce (sat) (v) ambient temperature t a (?c) 0 0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 i f =10ma i c =1ma ? 30 100908070605040302010 0 ? 10 ? 20 fig.11 collector - emitter saturation voltage vs. ambient temperature 7 collector current i c (ma) collector-emitter voltage v ce (v) 0 40 0246810 t a =25?c 30 20 10 p c (max.) i f =7ma i f =5ma i f =3ma i f =2ma i f =1ma i f =0.5ma fig.9 collector current vs. collector-emitter voltage current transfer ratio ctr (%) forward current i f (ma) 0.1 1 10 0 600 500 400 300 200 100 v ce =5v t a =25?c fig.8 current transfer ratio vs. forward current forward current i f (ma) 0.1 1 10 100 0 0.5 1 1.5 2 forward voltage v f (v) t a =25?c t a =75?c t a =100?c t a =50?c t a =0?c t a =? 25?c fig.7 forward current vs. forward voltage peak forward current i fm (ma) duty ratio 10 1 000 100 10 ? 2 10 ? 3 10 ? 1 1 pulse width 100s t a =25?c fig.6 peak forward current vs. duty ratio pc3h41xnip0f series
sheet no.: d2-a02102fen 8 voltage gain a v (db) ? 25 5 0.1 1 10 100 1 000 frequency f (khz) v ce =2v i c =2ma t a =25?c 0 ? 5 ? 10 ? 15 ? 20 r l =10k? 1k? 100? fig.16 frequency response ambient temperature t a (?c) ? 30 100908070605040302010 0 ? 10 ? 20 v ce =50v 10 ? 11 10 ? 5 10 ? 6 10 ? 7 10 ? 8 10 ? 9 10 ? 10 collector dark current i ceo (a) fig.12 collector dark current vs. ambient temperature load resistance r l (k?) 0.1 1 10 100 v ce =2v, i c =2ma 1 tf ts tr td 10 responce time (s) fig.13 response time vs. load resistance (active region) 10% input output input output 90% t s t d v cc r d r l t f t r please refer to the conditions in fig.13 and fig.14 v ce fig.15 test circuit for response time load resistance r l (k?) 1 1 10 100 1 000 v cc =5v, i f =1ma, t a =25?c 10 tf ts tr td 100 responce time ( s) fig.14 response time vs. load resistance (saturation region) collector-emitter saturation voltage v ce (sat) (v) forward current i f (ma) 0 5 0246810 t a =25?c 4 3 2 1 i c =7ma i c =5ma i c =3ma i c =2ma i c =1ma i c =0.5ma fig.17 collector-emitter saturation voltage vs. forward current remarks : please be aware that all data in the graph are just for reference and not for guarantee. pc3h41xnip0f series
sheet no.: d2-a02102fen design considerations while operating at i f <0.5ma, ctr variation may increase. please make design considering this fact. in case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through ired or current may change. if the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of ired. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 1.5 1.27 0.8 6.3 (unit : mm) design guide pc3h41xnip0f series
sheet no.: d2-a02102fen manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 260?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) pc3h41xnip0f series
sheet no.: d2-a02102fen solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde). presence of odc 11 pc3h41xnip0f series
sheet no.: d2-a02102fen 12 package specification tape and reel package package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g l b h a c h 5? max. a 12.0 0.3 b 5.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 7.5 0.1 i 0.3 0.05 j 2.3 0.1 k 3.1 0.1 f 4.0 0.1 g 1.5 +0.1 ? 0 l 1.6 +0.1 ? 0 dimensions list (unit : mm) a c e g f b d a 330 b 13.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 dimensions list (unit : mm) pull-out direction [packing : 3 000pcs/reel] reel structure and dimensions direction of product insertion pc3h41xnip0f series
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems rela- ted to any intellectual property right of a third party re- sulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the spec- ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufac- turing locations are also subject to change without no- tice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high lev- el of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment --- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall with- in the scope of strategic products described in the for- eign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp de- vices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, elec- tronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. 13 sheet no.: d2-a02102fen important notices pc3h41xnip0f series [e211]

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